MF211 Thermal Potting Sealant
Classification：
Features
Introduction:
MF211 thermally conductive silicone encapsulants can be cured at room temperature, but also can accelerate the curing at high temperatures. When cured, no significant contraction in varied materials.
Features:
In a wide temperature and humidity range, it can eliminate the stress arising from shock and vibration.
Good repairability; no by-products generated during curing, no solvent and deep curing.
Excellent dielectric properties, flame retardancy; excellent thermal conductivity.
Good waterproof performance; good adhesion with glass, aluminum and PC.
Purposes:
Mainly applied in power supplies, ordinary potting connectors, sensors, industrial controllers, transformers, amplifiers, high voltage resistors, relays and power module and the rectifier circuit.
Instructions:
1. Surface cleaning: To ensure a good adhesion, prior to use with a clean lint-free cloth to clean the sticky material, ensure dry and free of dirt. The solvent can be acetone, xylene and the like.
2. Com A, Com B is mixed in mass ratio of 1:1; both automatically and manually mixing are optional.
3. Vacuum degassing for potting glue is essential in mixing.
Restrictions:
The following materials, such as chemicals, curing agents and plasticizers can inhibit MF210 thermal silicone encapsulants cure, need to pay particular attention to:
1. Organic tin and other Pb, Hg, As and other ionic compound.
2. Organotin catalysts containing silicone rubbers.
3. Containing N, S, P and other organic compounds.
4. Plasticizer containing an unsaturated hydrocarbon as well as some solder residue.
Precautions:
After a long-term place, rubber will be tiered. When using, to make it even by stirring, which does not affect the nature of the adhesive.
Storage:
12 months stored in a cool, ventilated and dry place.
Transportation:
The product is non-dangerous, can be transported by vehicles, ships, trains and other means.
Package:
Com A: 25kg / barrel Com B: 25kg / barrel
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